dc.contributor.author |
Tshabalala, Lerato C
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dc.contributor.author |
Pityana, Sisa L
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dc.contributor.author |
Styne, J
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dc.contributor.author |
Höfer, M
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dc.contributor.author |
Schäfer, L
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dc.date.accessioned |
2013-04-18T06:48:22Z |
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dc.date.available |
2013-04-18T06:48:22Z |
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dc.date.issued |
2012-09 |
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dc.identifier.citation |
Tshabalala, L, Pityana, S, Styne, J, Höfer, M and Schäfer, L. 2012. Process control & monitoring for laser micromaching of Si3N4 ceramics. In: International Congress on Applications of Lasers and Electro-Optics (ICALEO), Anaheim Marriott Hotel® Resort, USA, 23-27 September 2012 |
en_US |
dc.identifier.uri |
http://hdl.handle.net/10204/6684
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dc.description |
International Congress on Applications of Lasers and Electro-Optics (ICALEO), Anaheim Marriott Hotel® Resort, USA, 23-27 September 2012 |
en_US |
dc.description.abstract |
Laser machining which is a non-contact process that offers the advantage of machining advanced ceramics. In laser machining Si3N4, surface temperature is increased and controlled to evaporate the YSiAlON glassy phase of the Si3N4. However, the formation of deep grooves often produced cracks that reduce the material strength. This work explores the diagnostic parameters of solid state lasers varying wavelength and pulse duration for ceramic micromachining. The micromachining process parameters that were monitored and controlled for laser performance are pulse energy, repetition rate and pulse duration. The focused beam size of the ultrashort laser (ns) and the longer (ns) laser pulses were 16µm and 40µm respectively. The primary aim for this research is to evaluate the two types of laser that would offer the best results with respect to material removal mechanism, micro-crack reduction, surface composition and surface roughness. |
en_US |
dc.language.iso |
en |
en_US |
dc.publisher |
International Congress on Applications of Lasers & Electro–Optics |
en_US |
dc.relation.ispartofseries |
Workflow;10295 |
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dc.subject |
Laser machining |
en_US |
dc.subject |
Ceramic micromachining |
en_US |
dc.subject |
Advanced ceramics |
en_US |
dc.subject |
Micromachining |
en_US |
dc.title |
Process control & monitoring for laser micromaching of Si3N4 ceramics |
en_US |
dc.type |
Conference Presentation |
en_US |
dc.identifier.apacitation |
Tshabalala, L. C., Pityana, S. L., Styne, J., Höfer, M., & Schäfer, L. (2012). Process control & monitoring for laser micromaching of Si3N4 ceramics. International Congress on Applications of Lasers & Electro–Optics. http://hdl.handle.net/10204/6684 |
en_ZA |
dc.identifier.chicagocitation |
Tshabalala, Lerato C, Sisa L Pityana, J Styne, M Höfer, and L Schäfer. "Process control & monitoring for laser micromaching of Si3N4 ceramics." (2012): http://hdl.handle.net/10204/6684 |
en_ZA |
dc.identifier.vancouvercitation |
Tshabalala LC, Pityana SL, Styne J, Höfer M, Schäfer L, Process control & monitoring for laser micromaching of Si3N4 ceramics; International Congress on Applications of Lasers & Electro–Optics; 2012. http://hdl.handle.net/10204/6684 . |
en_ZA |
dc.identifier.ris |
TY - Conference Presentation
AU - Tshabalala, Lerato C
AU - Pityana, Sisa L
AU - Styne, J
AU - Höfer, M
AU - Schäfer, L
AB - Laser machining which is a non-contact process that offers the advantage of machining advanced ceramics. In laser machining Si3N4, surface temperature is increased and controlled to evaporate the YSiAlON glassy phase of the Si3N4. However, the formation of deep grooves often produced cracks that reduce the material strength. This work explores the diagnostic parameters of solid state lasers varying wavelength and pulse duration for ceramic micromachining. The micromachining process parameters that were monitored and controlled for laser performance are pulse energy, repetition rate and pulse duration. The focused beam size of the ultrashort laser (ns) and the longer (ns) laser pulses were 16µm and 40µm respectively. The primary aim for this research is to evaluate the two types of laser that would offer the best results with respect to material removal mechanism, micro-crack reduction, surface composition and surface roughness.
DA - 2012-09
DB - ResearchSpace
DP - CSIR
KW - Laser machining
KW - Ceramic micromachining
KW - Advanced ceramics
KW - Micromachining
LK - https://researchspace.csir.co.za
PY - 2012
T1 - Process control & monitoring for laser micromaching of Si3N4 ceramics
TI - Process control & monitoring for laser micromaching of Si3N4 ceramics
UR - http://hdl.handle.net/10204/6684
ER -
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en_ZA |