An impedance assisted novel electrochemical technique has been employed to develop copper oxide (Cu2O) thin films on F-doped tin oxide (FTO)-coated glass substrate. Application of various potentials (-0.60 to -0.40 vs (Ag/AgCl)/V) in the presence of different ranges of frequency can lead to the attainment of high-quality Cu2O crystallites. The dependency of the frequency boundary (i.e. in terms of deposition time) with structural, morphological, optical and photoelectrochemical (PEC) behavior of the Cu2O thin films have been studied. The PEC performance of the optimized Cu2O electrode significantly enhances the water reduction photocurrent to -2.9 mA cm-2. The Cu2O thin film developed in this study exhibits superior photoelectrochemical performance in comparison with the conventionally electrodeposited materials.
Reference:
Shyamal, S. et al. 2019. Development of Cu2O thin films under the influence of electrochemical impedance: Applications in improved photoelectrochemical water reduction. Electrochimica Acta, vol. 308, pp. 384-391
Shyamal, S., Maity, A., Satpati, A., & Bhattacharya, C. (2019). Development of Cu2O thin films under the influence of electrochemical impedance: Applications in improved photoelectrochemical water reduction. http://hdl.handle.net/10204/11159
Shyamal, S, Arjun Maity, AK Satpati, and C Bhattacharya "Development of Cu2O thin films under the influence of electrochemical impedance: Applications in improved photoelectrochemical water reduction." (2019) http://hdl.handle.net/10204/11159
Shyamal S, Maity A, Satpati A, Bhattacharya C. Development of Cu2O thin films under the influence of electrochemical impedance: Applications in improved photoelectrochemical water reduction. 2019; http://hdl.handle.net/10204/11159.
Copyright: 2019 Elsevier. Due to copyright restrictions, the attached PDF file only contains the abstract of the full text item. For access to the full text item, please consult the publisher's website. The definitive version of the work is published in Electrochimica Acta, vol. 308, pp. 384-391