Author:Mkhohlakali, AC; Fuku, X; Modibedi, Remegia M; Khotseng, LE; Mathe, Mkhulu KDate:Jul 2021Electrochemical atomic layer deposition was used to form bimetallic (BiPd, CuPd) and trimetallic (CuBiPd) thin films via surface-confined reactions. Pd thin films were characterized by cyclic voltammetry, scanning electron microscopy (SEM) ...Read more